PLASMA Stencils
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INNOVATIVE SOLUTIONS FOR THE PRINTING PROCESS
Added value
❚ Improved contour stability ❚ Greater paste volumes ❚ Reduced cleaning
Short Description: The PLASMA stencil® opens up new savings potentials in electronics manufacture and increases the economic efficiency of the printing process. Small strucutures, such as fine-pitch openings, 0201, 01005, 03015 (metric) and μBGA, are released significantly better. As a result of the improved release, less residues of the printing medium remain in the stencil openings. Drying of paste residues is reduced and start-up behaviour after short line stops is therefore improved. This results in less rework and fewer rejects. Manufacturing time and costs are also reduced.
When evaluating the condition of the stencil based on the de- viation of the transferred paste volume, the PLASMA stencil® impressively increases the stencil service life. Not only are the effects of downtimes of the manufacturing line reduced, but also a more consistent printing performance over the entire service life of the stencil can be proven. The number of possible prints between underside cleanings is significantly higher.
This results in a more consistent print performance as the stencil needs to "start flowing" over the next 1 - 3 prints after every completed underside cleaning. The PLASMA stencil reduces the number of „restarts“ to a minimum. In addition, the line output can be improved as less production time is spent on cleaning. You save time and cleaning material while at the same time enhancing the quality of your prints.
Technical Data
Thickness approx. 400 nm – 600 nm
Application full surface
Smallest opening same as the stencil thickness
Characteristics • reduces the wettability of the surface
• better release characteristic
• less residues in the opening
• easier to clean
• reduced bridging
• less cleaning work
Contact angle with >100°
water
Hardness 200 … 300 HV
Print Quality
Example for the print quality of a 150 μm thick PLASMA Stencil and in comparison the print quality of the same opening sizes without coating. Each photo shows the tenth print. Printing was carried out with type 3 solder paste. The photos were taken at different magnifications. Results are printed with optimised process parameter on an fully meta-lized PCB.
10th print (without cleaning)
normal stencil
CK PLASMA Stencil®
Depot
Land- and opening width: 150 μm
Thickness ratio: 1,00
Area ratio: 0,48
BGA-Pads (round)
Diameter: 250 μm
Thickness ratio: 1,67
Area ratio: 0,42
Surface scan
(round pads)
Competence. Quality. Reliability.
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CHRISTIAN KOENEN GMBH
Otto-Hahn-Straße 24 / 85521 Ottobrunn-Riemerling Germany
T+49 89 66 56 18-0 / F+49 89 66 56 18-330
info@ck.de